Zulfa Fakhrina, Andromeda Dwi Laksono, and Hizkia Alpha Dewanto. “Influence Of Reflow Time On IMC Formation At SAC305 Solder And Cu Substrate Interface”. Metallurgical Engineering and Materials Innovation 1, no. 2 (December 30, 2025): 1–10. Accessed January 21, 2026. https://journal.itk.ac.id/index.php/memi/article/view/8481378.