ZULFA FAKHRINA; ANDROMEDA DWI LAKSONO; HIZKIA ALPHA DEWANTO. Influence Of Reflow Time On IMC Formation At SAC305 Solder And Cu Substrate Interface. Metallurgical Engineering and Materials Innovation, [S. l.], v. 1, n. 2, p. 1–10, 2025. Disponível em: https://journal.itk.ac.id/index.php/memi/article/view/8481378. Acesso em: 21 jan. 2026.